ISL8501EVAL1Z【PDF 5/19 页】EVALUATION BOARD FOR ISL8501

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ISL8501

Absolute Maximum Ratings (Note 1)

Thermal Information

VIN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +26V

Thermal Resistance

θ JA (°C/W)

θ JC (°C/W)

VIN_LDOx to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V

BOOT to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +33V

PHASE to BOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -6V to +0.3V

VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V

VOUT, LDO1, LDO2 to GND . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V

FB_PWM, FB_LDOx to GND. . . . . . . . . . . . . . . . . . . . . -0.3V to +6V

PG_PWM, PG_LDOx to GND . . . . . . . . . . . . . . . . . . . . -0.3V to +6V

EN, EN_LDOx to GND. . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V

QFN Package (Notes 1, 2). . . . . . . . . . 36 5

Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C

Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C

Junction Temperature Range. . . . . . . . . . . . . . . . . .-55°C to +150°C

Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C

Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C

Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

CC1, CC2 to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V

VCC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and

result in failures not covered by warranty.

*An accidental short between VCC and GND may cause excessive heating and permanent damage to the device.

NOTES:

1. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See

Tech Brief TB379 for details.

2. For θ JC , the “case temp” location is the center of the exposed metal pad on the package underside. See Tech Brief TB379 for details.

Electrical Specifications

Unless Otherwise Noted, All Parameter Limits are Guaranteed Over the Recommended Operating Conditions

and the Typical Specifications are Measured at the Following Conditions: T A = -40°C To +85°C (Note 7),

V IN = 6V to 25V, Unless Otherwise Noted. Typical Values are at T A = +25°C.

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

SUPPLY VOLTAGE

VIN Voltage Range

VIN

6

25

V

VIN connected to VCC

4.5

5.0

5.5

V

VIN_LDOx Voltage Range

(Note 6)

1.8

4.6

V

VIN Operating Supply Current

VIN Shutdown Supply Current

I OP

I SD

(Note 3)

EN = EN_LDOx = GND

2.5

70

3.5

100

mA

μ A

POWER-ON RESET

VCC POR Threshold

Rising Edge

4.25

4.40

4.50

V

Hysteresis

260

mV

VIN_LDOx POR Threshold

Rising Edge

Hysteresis

1.2

200

V

mV

INTERNAL VCC LDO

VCC Output Voltage Range

VIN = 6V to 25V, I VCC = 0mA to 50mA

4.5

5.00

5.5

V

REFERENCE

Reference Voltage

V FB

VIN = 6V to 25V, I REF = 0

0.590

0.6

0.609

V

STANDARD BUCK PWM REGULATOR

FB_PWM Line Regulation

IOUT = 0mA, VIN = 6V to 25V

-0.5

0.5

%

FB_PWM Leakage Current

VFB = 0.6V

0

50

100

nA

OSCILLATOR AND PWM MODULATOR

Nominal Switching Frequency

Modulator Gain

Peak-to-Peak Sawtooth Amplitude

PWM Ramp Offset Voltage

Maximum Duty Cycle

f SW

A MOD

V RAMP

V OFFSET

DC MAX

T A = -40°C to +85°C, VCC = 5V

VIN = 12V (AMOD = 10/VIN)

VIN = 12V (VPP = VIN/10)

COMP >4V

450

0.73

0.70

80

500

0.86

1.2

0.8

83

550

0.99

0.91

kHz

V/V

V

V

%

ERROR AMPLIFIER

Open-Loop Gain

88

dB

Gain Bandwidth Product

GBWP

15

MHz

Slew Rate

SR

COMP = 10pF

5

V/ μ s

5

FN6500.1

July 12, 2007

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